报告题目：High Performance DC/DC Converter Magnetic Integration
主讲人: Dr. Yaxiao Qin
Dr. Yaxiao Qin received his Ph.D degree and master of science degree from the University of Hong Kong, and Virginia Tech (USA), respectively. Since 2016, Dr. Yaxiao Qin has held research position as senior scientist in Maxim R&D Lab in silicon valley, California, USA. At the same time, he is an adjunct scientist in Department of Electrical Engineering at Stanford University in silicon valley, California, USA. He has authored or coauthored more than 20 IEEE papers. He received the first prize paper award of IEEE Transactions on Power Electronics. His current research interests include wide bandgap devices (GaN/SiC) applications, low voltage high-current conversion techniques for data center and computing applications, high efficiency power converters, LED driving circuits.
Because of the rapid growth of cloud computing and digital information storage, data centers are becoming one of the largest electricity consumers around the world. However, the efficiency of a typical data center is less than 50 % considering all losses including power conversion, power distribution, and cooling for the center space. Recent advancement of semiconductor power devices including both wide-band-gap devices (GaN and SiC) and silicon devices (Trench MOS, LDMOS, etc.) has been pushing power conversion to higher efficiency and density, due to the continuous improvement of the device Figure of Merits (FOM). In the meantime, however, passive components including capacitors and magnetics do not obey Moore’s law. Particularly in many modern power electronics applications, magnetic components are becoming bottlenecks in terms of further efficiency and density improvement. For instance, in telecom and data center motherboards where high ratio DC-DC bus conversion is often required, transformer based topologies such as active-clamp forward, full bridge and LLC resonant converters are prevailing regardless of galvanic isolation requirement. Transformer design and integration for these topologies have become the greatest challenge for system optimization as it heavily dictates the overall system efficiency and density. A new Transformer design and integration has been developed and demonstrated for the next-gen power supply on data center server boards.